Overview
At Falcon Defence, we bring over 50 years of combined expertise in Embedded Hardware Design and Development. Our team delivers robust, high-performance PCB layout and board design services, supporting the creation of prototype boards, subsystems, and full systems tailored to demanding mission-critical applications.
We offer comprehensive end-to-end board design solutions—from concept and design verification to signal, thermal, and structural integrity analysis, ruggedization, and prototyping. Our process includes detailed simulations and rigorous testing to ensure full compliance with functional and regulatory standards. With a strong focus on performance and manufacturability, our experienced engineers help accelerate time-to-market for our clients.
Embedded Hardware Design Expertise
We specialize in the design and development of High-Speed Digital, Analog, Mixed Signal, RF, and Power Supply solutions, serving a wide range of needs—from prototype builds to complex system designs.
Expertise
Falcon Defence offers a comprehensive suite of cutting-edge Embedded Design and Development services tailored for mission-critical Aerospace and Defence applications.
ARCHITECTURE
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- i.MX21, i.MX27, i.MX25, i.MX51, PowerPC, QorIQ
- OMAP4/5, Sitara and DaVinci, C55x DSP, C64x DSP, C67x DSP, MSP430
- ADSP 218x, ADSP-219x, SHARC, TigerSHARC, Blackfin
- ARM7, ARM9, ARM11, ARM® Cortex™-A8/A9/A15
- 8051, x86, ATOM, Xeon
- FPGA – AMD Xilinx: Spartan, Virtex, Kintex, Artix and Altera: Stratix, Arria, Cyclone
- RFSOC: Altera RF FPGA and AMD Xilinx RFSoC
PCB LAYOUT
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- PCB Design Component and Library Management
- Signal Integrity Analysis
- Power Integrity Analysis
- Thermal Analysis
- Power Distribution Network Analysis
- Structural Analysis
EMBEDDED PROCESSOR DESIGNS
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- Multi-core, multi-processor hardware architectures
- Systems for navigation, audio, and video applications
- Low-power board designs for wearables, handhelds, and portable devices
- Development platforms for streamlined wireless and multimedia device design
COMPACT, HIGH-DENSITY DESIGNS
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- Cost and energy-efficient designs for next-gen devices
- Optimized layouts for small-form-factor hardware
- High-Density Interconnect (HDI) with Blind and Buried Microvias
- Package on Package (PoP) Technology
- Rigid-Flex and Flex PCBs
POWER OPTIMIZED DESIGNS
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- Video-capable low-power board solutions
- Dynamic frequency scaling & reduced power dissipation
- Hardware/software co-optimization
- Advanced power and memory management techniques
- Application-specific power-performance trade-offs
COMPLIANCE AND STANDARDS
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- MIL-STD-810E/F – Environmental testing for military equipment
- JSS 55555 – Environmental testing for electronic/electrical gear
- MIL-STD-454 – General requirements for electronic equipment
- BS 3G-100 – British standards for electronic systems
- MIL-STD-704 D/E – Aircraft power supply specifications
- MIL-STD-461 D/E, 462 D – EMI/EMC compliance standards